|Title||How to effectively overcome the limitations of heat resistance|
|Description||For a long time, how to improve the heat resistance of the resin EN12413 cutting discs, so that it can work normally under high-temperature conditions, and to avoid weaknesses has always been a problem that has been plagued by the industry. Many people have tried to improve the heat resistance of the resin itself, and tried to break through the research of new resin synthesis or resin modification, and made some progress. However, as a member of the organic material family, its physical and chemical properties determine its space for heat resistance improvement. We only need to look at the fact that polyphenylene sulfide (PPS) has a heat-resistant temperature limit of 400 ° C and polyphenylthiazole can only withstand 500 ° C. Others have made a fuss about the metal powder formulation of resin binders. It is hoped that by increasing the proportion of metal components such as Cu powder with good thermal conductivity, the effect of rapidly transferring the grinding heat from the "metal bridge" can be achieved. Regardless of the effectiveness of this "bridge", the increase of metal powder not only increases the cost of the formula but also changes the microstructure hardness of the resin bond diamond cutting disc, which will inevitably have a negative impact on its sharpness and self-sharpness. The author tried to find another way. Based on the characteristics that some substances absorb a large amount of thermal energy during phase change, the resin bond cutting disc formulation disc change is used to obtain the "self-heating" performance of the resin bond diamond cutting disc. After trial and screening, it has indeed achieved breakthroughs in improving its heat dissipation performance and has obtained the national invention patent: "Strong heat-dissipating resin diamond cutting disk" (Patent No.: ZL01129089.7 International Patent Main Classification: CO8J 5/14). The resin bond diamond cutting disc produced by the invention patent has always maintained a good working state during grinding, and the advantages of the conventional resin bond diamond cutting disc are outstanding: (1) Sharp grinding, no clogging when used, less noise; (2) The working layer of the cutting disc has no cracks during operation, and “de-ringing” (ie, the diamond working layer and the metal substrate are separated from each other under the action of grinding heat) occur; (3) There is no crack, ablation or metallographic structure change on the surface of the workpiece; (4) The working layer of the cutting disc has high strength and can withstand the grinding feed amount more than 10 times larger than the traditional resin bond diamond cutting disc; (5) The working layer of the cutting disc is resistant to wear, and the service life of the 6 inch es cutting disc of the same specification, particle size and concentration is more than 20%; Grinding the same workpiece, the grinding cost is 15% lower than the traditional resin bond diamond cutting disc of the same specification, particle size, and concentration.|
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